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  july 1998 f dp6670a l / fdb6670a l n-channel logic level powertrench tm mosfet general description features _________________________________________________________________________________ absolute maximum ratings t c = 25c unless otherwise noted symbol parameter f dp6670a l f db6670a l units v dss drain-source voltage 30 v v gss gate-source voltage 20 v i d drain current - continuous (note 1) 80 a - pulsed (note 1) 240 p d total power dissipation @ t c = 25 c 75 w derate above 25 c 0.5 w/ c t j ,t stg operating and storage temperature range -65 to 175 c t l maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds 275 c thermal characteristics r q jc thermal resistance, junction-to-case 2 c/w r q ja thermal resistance, junction-to-ambient 62.5 c/w f dp6670a l rev.c 80 a, 3 0 v. r ds(on ) = 0.0065 w @ v gs =10 v, r ds(on) = 0.0085 w @ v gs = 4.5 v. critical dc electrical parameters specified at elevated temperature. rugged internal source-drain diode can eliminate the need for an external zener diode transient suppressor. high performance trench technology for extremely low r ds(on) . 175c maximum junction temperature rating. this n-channel logic level mosfet has been designed specifically to improve the overall efficiency of dc/ dc converters using either synchronous or conventional switching pwm controllers. these mosfets feature faster switching and lower gate charge than other mosfets with comparable r ds(on) specifications. the result is a mosfet that is easy and safer to drive (even at very high frequencies), and dc/ dc power supply designs with higher overall efficiency . s d g ? 1998 fairchild semiconductor corporation
electrical characteristics (t c = 25c unless otherwise noted) symbol parameter conditions min typ max unit drain-source avalanche ratings (note 1) w dss single pulse drain-source avalanche energy v dd = 15 v, i d = 80 a 300 mj i ar maximum drain-source avalanche current 80 a off characteristics bv dss drain-source breakdown voltage v gs = 0 v, i d = 250 a 30 v d bv dss / d t j breakdown voltage temp. coefficient i d = 250 a , referenced to 25 o c 22 mv/ o c i dss zero gate voltage drain current v ds = 24 v, v gs = 0 v 1 a i gssf gate - body leakage, forward v gs = 20 v, v ds = 0 v 100 na i gssr gate - body leakage, reverse v gs = -20 v, v ds = 0 v -100 na on characteristics (note 2) v gs (th) gate threshold voltage v ds = v gs , i d = 250 a 1 1.5 3 v d v gs(th) / d t j gate threshold voltage temp.coefficient i d = 250 a , referenced to 25 o c -5 mv/ o c r ds(on) static drain-source on-resistance v gs = 10 v, i d = 40 a 0.005 0.0065 w t j = 125 c 0.0072 0.0091 v gs = 4.5 v, i d = 37 a 0.0067 0.0085 i d (on) on-state drain current v gs = 10 v , v ds = 10 v 80 a g fs forward transconductance v ds = 10 v, i d = 40 a 86 s dynamic characteristics c iss input capacitance v ds = 1 5 v, v gs = 0 v, f = 1.0 mhz 3200 pf c oss output capacitance 820 pf c rss reverse transfer capacitance 400 pf switching ch aracteristics (note 1 ) t d(on) turn - on delay time v dd = 10 v, i d = 1 a, v gs = 10 v, r gen = 6 w 15 27 ns t r turn - on rise time 15 27 ns t d(off) turn - off delay time 85 105 ns t f turn - off fall time 42 68 ns q g total gate charge v ds = 15 v i d = 40 a, v gs = 5 v 35 50 nc q gs gate-source charge 9 nc q gd gate-drain charge 16 nc drain-source diode characteristics i s maximum continuous drain-source diode forward current (note 1 ) 80 a i sm maximum pulsed drain-source diode forward current (note 1 ) 240 a v sd drain-source diode forward voltage v gs = 0 v, i s = 40 a (note1 ) 0.9 1.3 v t rr reverse recovery time v gs = 0 v, i f = 40 a di f /dt = 100 a/s 32 55 ns i rr reverse recovery current 0.83 5 a notes 1. pulse test: pulse width < 300 s, duty cycle < 2.0%. f dp6670a l rev.c
f dp6670a l rev.c typical electrical characteristics 0 0.5 1 1.5 2 2.5 3 0 25 50 75 100 v , drain-source voltage (v) i , drain-source current (a) ds d 6.0v 4.5v 3.0v v = 10v gs 2.5v 3.5v -50 -25 0 25 50 75 100 125 150 0.6 0.8 1 1.2 1.4 1.6 t , junction temperature (c) drain-source on-resistance j r ,normalized ds(on) v = 10v gs i = 40a d 1 1.5 2 2.5 3 3.5 4 0 12 24 36 48 60 v , gate to source voltage (v) i , drain current (a) v = 10v ds gs d 125c t = -55c a 25c figure 5. transfer characteristics . 0 20 40 60 80 100 0.5 1 1.5 2 2.5 i , drain current (a) drain-source on-resistance 4.5v 10v 6.0v 4.0v v =3.5v gs d r , normalized ds(on) figure 1. on-region characteristics. 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0.001 0.01 0.1 1 10 60 v , body diode forward voltage (v) i , reverse drain current (a) t = 125c a 25c -55c v =0v gs sd s 2 4 6 8 10 0 0.005 0.01 0.015 0.02 v , gate to source voltage (v) gs r , on-resistance (ohm) ds(on) 25c i =40a d t =125c a figure 3. on-resistance variation with temperature . figure 4 . on-resistance variation with gate-to -source voltage. figure 2. on-resistance variation with drain current and gate voltage . figure 6 . body diode forward voltage varia tion with source current and temperature.
f dp6670a l rev.c typical electrical characteristics (continued) 0 10 20 30 40 50 60 70 80 0 2 4 6 8 10 q , gate charge (nc) v , gate-source voltage (v) g gs i = 40a d v = 5v ds 10v 15v 0.1 0.2 0.5 1 2 5 10 30 100 200 500 1000 2000 4000 7000 v , drain to source voltage (v) capacitance (pf) ds c iss f = 1 mhz v = 0 v gs c oss c rss figure 8. capacitance characteristics . figure 7 . gate charge characteristics. 0.3 0.5 1 2 5 10 30 60 0.5 1 2 5 10 20 50 100 200 500 v , drain-source voltage (v) i , drain current (a) ds d 10ms 1s 100ms 10s dc r limit ds(on) v = 10v single pulse r = 2 c/w t = 25 c gs c q jc o 100s figure 9. maximum safe operating area. figure 10 . single pulse maximum power dissipation. 0.01 0.05 0.1 0.5 1 5 10 50 100 500 1000 0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1 t ,time (ms) transient thermal resistance single pulse d = 0.5 0.1 0.05 0.02 0.01 0.2 r(t), normalized effective 1 duty cycle, d = t /t 1 2 r (t) = r(t) * r r = 2c/w q jc q jc q jc t - t = p * r (t) q jc c j p(pk) t 1 t 2 figure 11 . transient thermal response curve . 0.01 0.1 1 10 100 1,000 0 500 1000 1500 2000 2500 3000 single pulse time (sec) power (w) single pulse r =2c/w t = 25c q jc c
disclaimer fairchild semiconductor reserves the right to make changes without further notice t o any products herein t o improve reliability , function or design. fairchild does not assume any liability arising out of the applica tion or use of any product or circuit described herein; neither does it convey any license under its p a tent rights, nor the rights of others. trademarks the following are registered and unregistered trademarks fairchild semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. life support policy fairchild?s products are not authorized for use as critical components in life support devices or systems without the express written approval of fairchild semiconductor corporation. as used herein: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. product status definitions definition of terms datasheet identification product status definition advance information preliminary no identification needed obsolete this datasheet contains the design specifications for product development. specifications may change in any manner without notice. this datasheet contains preliminary data, and supplementary data will be published at a later date. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. this datasheet contains final specifications. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. this datasheet contains specifications on a product that has been discontinued by fairchild semiconductor. the datasheet is printed for reference information only. formative or in design first production full production not in production optologic? optoplanar? pacman? pop? power247? powertrench qfet? qs? qt optoelectronics? quiet series? silent switcher fast fastr? frfet? globaloptoisolator? gto? hisec? isoplanar? littlefet? microfet? micropak? microwire? rev. h4 a acex? bottomless? coolfet? crossvolt ? densetrench? dome? ecospark? e 2 cmos tm ensigna tm fact? fact quiet series? smart start? star*power? stealth? supersot?-3 supersot?-6 supersot?-8 syncfet? tinylogic? trutranslation? uhc? ultrafet a a a star*power is used under license vcx?


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